EjecuciónDevelopment of Radiation Hard Application Specific Integrated Circuits (ASICs)

Ejecución

Development of Radiation Hard Application Specific Integrated Circuits (ASICs)

The European Joint Undertaking for ITER and the Development of Fusion Energy ('Fusion for Energy') · Arr. Turnhout, Extranjero (Belgica)

48 meses

Duración

MAGICS Technologies NV

Adjudicatario

Objeto del contrato

Descripción

The subject matter of the contract is the supply of electronic components for remote handling equipment developers as well as the provision of design and development activities. The subject matter of the Contract is divided into two sub projects: 1. development of radhard multiplexing systems, 2. development of radhard camera electronics. Both projects address the design upgrade, manufacturing, testing, qualification and prototype validation of radhard Application Specific Integrated Circuits (ASICs). The manufacturing batches of radhard electronics shall cover the needs for the F4E remote handling equipment.

Sector

Energía

Tipo

Suministros · Abierto

CPV

31710000Equipo electrónico

73300000Diseño y ejecución en materia de investigación y desarrollo

Ejecución

Arr. Turnhout, Extranjero (Belgica) · 48 meses

Tramitación

Evaluación

Requerimiento pendiente

Ejecución

Cumplimiento19 nov 2021

Inteligencia competitiva

Profesional

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Órgano de contratación

The European Joint Undertaking for ITER and the Development of Fusion Energy ('Fusion for Energy')

211 licitaciones

Lotes y adjudicaciones

Resultado de la adjudicación

MAGICS Technologies NV🇧🇪BE

6.372.209,87 €

Contrato (con IVA)

Form. 19 nov 2021

1 oferta

Modificaciones del contrato

1 modificación posterior a la adjudicación

Modificación 1

The contract is hereby amended as follows: - The estimated duration of the contract has been increased to 48 months. - The value of the contract has been increased to 6,372,209.87 EUR. - The following technical changes have been introduced: Introduction of the part2 of the SER development; Introduction of the part2 of the Bidirectional Serial Synchronous Controller Module (BiSS BCM) development; Additional Multi-Project Wafer (MPW) manufacturing cycle with improvements on Application Specific Integrated Circuits (ASICs) 1,2,5 and a BiSS Slave Module (BSM) level derisking test activity to confirm correct BSM behavior in an earlier stage. The MPW also includes the SER chip; Introduction of manufacturing of BSM material for Divertor Test Platform (DTP2); Testing the camera demo for radiation

Fuente: TED · Datos tratados por Licto